The first phones with the Snapdragon 7 Gen 3 SoC will be released in collaboration with Qualcomm, Honor, and Vivo.
On Friday, November 17, Qualcomm revealed the latest Snapdragon 7 Gen 3 SoC smartphone chipset. The Snapdragon 7 Gen 2 chipset is replaced by the new mid-range 5G mobile platform, which offers additional on-device AI-based innovations. With a max CPU speed of 2.63GHz, the Snapdragon 7 Gen 3 is expected to outperform its predecessor by 50% in terms of GPU performance and 60% in terms of AI performance. The new chip, which goes by the product number SM7550-AB, is built using TSMC’s 4nm process technology. Honor and Vivo, two Chinese smartphone manufacturers, have stated that their next models would include the Snapdragon 7 Gen 3.
Qualcomm released a blog post announcing the Snapdragon 7 Gen 3 SoC. The new chip, which has a 1+3+4 architecture and is built on TSMC’s 4nm manufacturing technology, is expected to outperform the Snapdragon 7 Gen 2 by 60% in terms of AI performance per watt and by more than 50% in terms of GPU performance. It also promises a 20 percent improvement in power efficiency over the previous model. Within five minutes, Qualcomm’s Quick Charge 5 technology promises to fully charge a battery from empty to fifty percent.
As previously stated, the Kryo CPU has four efficiency cores clocked at 1.8GHz, three performance cores with a maximum speed of 2.4GHz, and a prime core clocked at 2.63GHz. With part number SM7550-AB, the Snapdragon 7 Gen 3 SoC offers some Snapdragon Elite Gaming capabilities, such as Adreno HDR Fast Blend and Qualcomm Game Quick Touch.
Up to 4K resolution displays at 60Hz refresh rate or WFHD+ resolution at 168Hz are supported by the new Qualcomm chip. A Qualcomm Spectra triple ISP, which supports 200-megapixel primary camera modules and records 4K HDR video at 60 frames per second, is built inside the Snapdragon 7 Gen 3 SoC. According to reports, it can handle three lenses being captured at once and offer imaging functions like AI Remosaic and AI Video Retouch. It is compatible with the newest 3200MHz LPDDR5T RAM.
A dual SIM dual active (DSDA) 5G and 4G Snapdragon X63 5G Modem-RF system is part of the Snapdragon 7 Gen 3 SoC’s connectivity portfolio. For Bluetooth 5.3 and Wi-Fi 6/6E connectivity, users will receive Qualcomm FastConnect 6700. The Hexagon NPU, compatibility for OpenGL ES 3.2, Vulkan 1.3, OpenCL 2.0 FP APIs, and triple frequency (L1/L5/L2) support in the GNSS antenna are some of the Snapdragon 7 Gen 3’s other standout features.
First to use the new 5G mobile platform are Honor and Vivo. This month is anticipated to see the announcement of their first smartphones powered by the Snapdragon 7 Gen 3 CPU. The new chipset may be used by the Honor Magic 6 and the Honor 100 series.
